Laile Photonics Launches New Dual FA Active Alignment Solution

2026-03-05

With the vigorous development of artificial intelligence technology, there is an urgent demand for high-speed and stable data transmission. AI computing power requirements are growing exponentially, and data center traffic continues to climb. As core components supporting backbone networks and intelligent computing centers, the market demand for 800G/1.6Tbps optical transceivers has experienced explosive growth.

In the high-speed optical transceiver manufacturing process, challenges such as low alignment efficiency, unstable yield, and high difficulty in employee training have become key bottlenecks restricting manufacturers' capacity expansion and stable delivery. This critical step of optical transceiver alignment and packaging can be said to be the core hurdle determining whether the high-speed optical interconnect industry can cross the "mass production gap."

Laile Photonics' newly upgraded Dual FA Active Alignment System is precisely built for the mass production of high-speed optical transceivers (800G/1.6T, etc.). Its core advantages lie in the dual innovation of efficiency and precision:

1. Doubled Efficiency: Adopts a unique dual-FA simultaneous alignment design, enabling synchronous operation of the TX and RX ends. Compared to traditional single-FA alignment, production efficiency is increased by over 50%.

2. Fully Automated Integration: Integrates high-precision image recognition, automatic leveling, and full-process automation of "alignment-dispensing-curing." With one-click operation, it significantly improves mass production stability and yield.

3. Wide Compatibility: Adaptable to various materials such as silicon photonics, thin-film lithium niobate, and III-V compounds, as well as full-series modules from 400G to 3.2T, meeting cutting-edge process requirements.