Hongfucheng Innovative Thermal Solutions Unlock Challenges in High-Compute Fields
2026-03-30
Hongfucheng has recently unveiled its full range of high-compute thermal products, offering a one-stop thermal management solution. Focusing on the thermal challenges of the high-compute industry, the company showcased two core product series: carbon-based thermal interface materials and metal-based thermal interface materials.
Covering everything from extreme heat dissipation to conventional thermal adaptation, and from precision assembly to stable operation, the products comprehensively address the needs of high-compute scenarios. Multiple products work together to build a full-condition thermal management system, helping compute systems break through thermal bottlenecks and achieve maximum performance.
Graphene Thermal Pads "Hold Their Ground" — New Liquid Metal Grease "Makes a Splash"
At Hongfucheng's booth, the veteran star product — "Graphene Thermal Pad" designed for high-power chips — still took center stage. With its high thermal conductivity, excellent compression resilience, and other core advantages, the product continued to attract attention from professionals in AI chips, automotive electronics, data centers, and other fields.
Making its debut, the new "Liquid Metal Grease" focuses on thermal dissipation in laptops, smartphones, graphics cards, and other consumer electronics, injecting new vitality into thermal solutions for consumer terminals.
Liquid Metal Grease — New Product Launch
Product Features
1. Utilizes liquid metal micro-droplet encapsulation technology, presented in a grease form without flowing;
2. Extremely low thermal resistance （≤0.045（@20 psi））, with performance close to that of pure liquid metal;
3. Easy to apply, with no liquid metal separation during the application process;
4. Long-term stability, with excellent crack resistance and pump-out resistance;
5. High reliability, with no powdering or cracking over extended use.
Online Message
Sweep the attention of Nanjing Takuso