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Hengtong’s CPO Polarization-Maintaining Fiber Reinforces the New Foundation of AI Computing Interconnection with Sub-Micron Precision
As the AI computing industry undergoes rapid iteration, CPO (Co-Packaged Optics), with its core advantages of low latency, high bandwidth, and low power consumption, has emerged as the core technology for optical interconnection in next-generation AI data centers.
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2026
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06
Counterpoint Research: Global Smartphone Shipments Hit 12-Year Low in 2026; Huawei May Be the Only Survivor Among Chinese Brands
According to the latest “Smartphone Market Outlook Tracker Report” released by market research firm Counterpoint Research, global smartphone shipments in 2026 are expected to decline 13.9% year-on-year to approximately 1.08 billion units, marking the lowest annual level since 2013.
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Changguang Chenxin Launches Point Laser Displacement CMOS Image Sensor
May 25, 2026 – Changguang Chenxin (HKEX: 3277) has released the GLR1202BSI-L, a new product in its GLR series. Designed specifically for high-speed point laser displacement sensor applications, this chip features an elongated large pixel architecture, backside illumination (BSI), and high-speed readout circuitry.
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05
Guangxi University Achieves New Progress in Near-Infrared Luminescent Materials and Devices
Recently, the Nanophotonics Materials and Technology team led by Professor Zou Bingso from the School of Resources, Environment and Materials at Guangxi University, in collaboration with Associate Professor Yang Li’na from the School of Computer, Electronics and Information and Professor Niu Quan from South China University of Technology, has achieved new advancements in the study of near-infrared luminescent materials and devices guided by artificial intelligence.
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