Teledyne Expands AxCIS Contact Image Sensor Series with New 1,800 dpi and 1,500 mm Models
2026-06-30
Teledyne DALSA has announced the expansion of its AxCIS™ series of high-speed, high-resolution, fully integrated line-scan imaging modules, now supporting resolutions up to 1,800 dpi and imaging lengths up to 1,500 mm. These easy-to-use contact image sensors (CIS) integrate the sensor, lens, and illumination into a single compact module, providing cost-effective inspection solutions for a wide range of demanding machine vision applications, including semiconductor wafer, battery, and print inspection.
The expanded AxCIS contact image sensor series from Teledyne DALSA now supports resolutions up to 1,800 dpi and imaging lengths up to 1,500 mm.
Built upon Teledyne's multi-line CMOS image sensor technology, the AxCIS delivers exceptional image quality: with a 14 µm pixel size, it achieves monochrome line rates up to 80 kHz or resolutions up to 1,800 dpi. For color inspection, it outputs native RGB tri-linear data at line rates up to 60 kHz (with 28 µm pixel size or 900 dpi resolution), enabling defect identification with unprecedented precision. The AxCIS also features a unique high dynamic range (HDR) capability to further enhance defect detection. Its distinctive sensor design covers the entire field of view with no missing pixels, achieving 100% seamless imaging without interpolation, while the telecentric lens supports high-precision metrology applications.
The AxCIS operates from a single 24 V power supply and enables flexible scaling across various fields of view. Its compact mechanical design, combined with an IP60-rated dust-protected optical path, makes it adaptable to systems with limited vertical space. The SFP+ fiber optic interface supports high-throughput data transmission over standard, low-cost, long-distance cables and provides immunity to electromagnetic interference (EMI), making it suitable for harsh industrial environments.
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