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Bourns Introduces New Shielded Power Inductors for High-Current, Ultra-Thin Automotive and DC-DC Designs

Bourns Introduces New Shielded Power Inductors for High-Current, Ultra-Thin Automotive and DC-DC Designs

July 24, 2026 – Bourns announced the launch of its SRP2010PA, SRP2510PA, and SRP2512PA series shielded power inductors, designed to support high-current operation in space-constrained electronic designs.

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2026

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07

JONHON Launches External Light Source Optical Connector to Support Next-Generation AI Supercomputing Optical Interconnection Upgrades

JONHON Launches External Light Source Optical Connector to Support Next-Generation AI Supercomputing Optical Interconnection Upgrades

As AI computing clusters rapidly scale from thousand-card to million-card ultra-large computing power configurations, data centers are facing exponential increases in bandwidth, power consumption, and thermal dissipation challenges.

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2026

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07

Schurter Launches New Self-Resettable Fuse (PPTC) Series, Delivering Extremely High Reliability with Compact Protection

Schurter Launches New Self-Resettable Fuse (PPTC) Series, Delivering Extremely High Reliability with Compact Protection

Schurter has introduced the new PFTA, PFTB, PFTC, and PFTL series of self-resettable fuses (PPTCs), designed to provide reliable self-resetting overcurrent and overtemperature protection for modern electronic applications.

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2026

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07

Teledyne Expands AxCIS Contact Image Sensor Series with New 1,800 dpi and 1,500 mm Models

Teledyne Expands AxCIS Contact Image Sensor Series with New 1,800 dpi and 1,500 mm Models

Teledyne DALSA has announced the expansion of its AxCIS™ series of high-speed, high-resolution, fully integrated line-scan imaging modules, now supporting resolutions up to 1,800 dpi and imaging lengths up to 1,500 mm.

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2026

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